WHO: Lucian Fogoros, Product Manager at Schneider Electric, will present “Machine Performance, OEE and IIoT Connectivity Made Easy” at PACK EXPO International. His focus will be to educate how powerful OEE functionality can be quickly implemented without a rip and replace strategy of existing automation equipment with HMI and industrial data management in the cloud. These solutions offer hardware agnostic connectivity, simplified integration and ready access to KPIs and reports. The IIoT can be leveraged for decision support, visibility and access to packaging data enabling smarter machines and continuous performance improvements.
WHAT: PACK EXPO International is the world’s largest, most comprehensive processing and packaging trade show in 2016, with over 50,000 industry professionals attending, 2,100 exhibitors, solutions for 40+ vertical markets and a comprehensive educational track that lasts for nearly four days.
WHERE: McCormick Place, N-4570, 2301 S King Drive, Chicago, IL 60616
WHEN: Wednesday, November 9, 2016, from 11:010 - 11:30 am, in the Innovation Stage (N-4570)